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DUXERIT lux 1 Layer aluminium PCB metalla PCB OSP
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Minimum Ordinis Quantity: |
1 PCS |
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pretium: |
Ex gerber |
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Details packaging: |
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Tempus adferendi: |
5 diebus |
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Pensio conditio: |
De transitu Tt / Tininitus / Union Occidentis / ddu |
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Facultates copiam: |
10000+ |
- Description
- Applications
- Italiae Commodum Collegit
- Quaestiones
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Locus originis: |
Sina |
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Notam nomen: |
WMDPCB |
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model Number: |
1 secundum lavacrum aluminium |
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Certification: |
ISO ISO 9001 |
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genus: |
1 stratum |
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Location Board; |
120*210MM / 2UP |
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silicium: |
V0 |
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basi materia: |
Aluminium |
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Liquid-Imaginable Image (LPI): |
nigreos |
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Superficiem treatment processus: |
OSP |
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application: |
dolor electronics |
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Type material: |
Seu rigidorum VOL |
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material: |
Aluminium subiectum supponeretur |
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Brand: |
wmdpcb |
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stratis: |
1stratum |
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tabula crassitudo: |
1.6mm |
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complevit lamina cuprea: |
2OZ |
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Latitudo Min.Line / Tractus: |
NA |
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Features technica: |
1Stratum Aluminium subiectum supponeretur |
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Location minimum Sanctus: |
NA |
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conductivity dielectric: |
2.0 W / Mk |
Circuitu tabula, PCB metallum, Aluminium PCB tabula Nudabitur, 1 stratum PCB, Superficiem treatment est enig 1u". 2.0mm±0.1Crassitudo mm Board. Aluminium base sit basis Material. Quod maxime in products Electronic Consumer. PCB Heatsinks Tims Core et ad Metallum
A basi metallum (aluminium PCB), uel interface materia scelerisque, components ponitur in contactum cum \ 'Superficies. Auctus est redacta ad temperatus scelerisque massa et calor dissipatio (conduction et convection). Multi-algarum PCB calor concidat Registration Adhibendis adnotatione ratio nostra existentium multilayer, nobis possunt ut subcriptio heatsinks ut PCB in 5 prior est minus vinculum.
