EN
ES
RU
PT
SV
DE
TR
FR
rigid printed board, Buried & Blind Via PCB, HDI. High layer PCB board. 8 layer board. Control Impedance board
|
Miinimum Kogus: |
1 tükk |
|
Hind: |
Põhineb gerberil |
|
Pakend andmed: |
|
|
Tarneaeg: |
8 päeva |
|
Maksetingimused: |
TT Transfer / paypal / Western Union / DDU |
|
Pakkumise võime: |
10000 |
- kirjeldus
- Rakendused
- Eelis
- Küsitlus
|
Lähtekoht: |
Hiina |
|
Tootja nimi: |
WMDPCB |
|
Mudel: |
8 layer blind-buried via board |
|
Certification: |
ISO 9001 |
|
Type: |
8 kiht |
|
Juhatuse suurus: |
85 * 85MM |
|
Süttivus: |
V0 |
|
Alusmaterjal: |
FR4 |
|
Liquid Photo-Imaginable (LPI): |
roheline |
|
Pinna töötlemise protsess: |
HASL |
|
Rakendus: |
meditsiiniseadmed |
|
Materjali tüüp: |
Jäik |
|
Materjal: |
Klaasplast Epoxy, FR4 |
|
Bränd: |
Wmdpcb |
|
Kihid: |
8Layer |
|
Paksus: |
1.6mm |
|
Valmis vask: |
1OZ kogu kiht |
|
Min.Line laius / ruum: |
4 / 4mil |
|
Tehnilised omadused: |
buried via: L2-L7, blind via: L1-L2 L7-L8 |
|
Minimaalne ava suurus: |
0.1mm |
|
Võrdlev jälgimise indeks: |
CTI 175V |
|
Klaasi ülemineku temperatuur: |
Tg 175 ° C |
|
Maksimaalne töötemperatuur: |
100 ℃ |
|
Lagunemistemperatuur |
Td 335 |
Naked Board, bare board, Use FR4 laminate material with tG > 175°C and td > 335°, Finished board thickness is to be 0.062”, Apply green liquid photo imageable solder mask to both sides of the board over bare copper, Silkscreen is white, permanent, organic, non-conductive ink. HASL--hot air solder leveled using PbSn solder, unit size：85*85MM, ship as single, The technical features is multilayer board, buried via: L2-L7 min.hole size :0.2MM, blind via: L1-L2 L7-L8 min.hole size:0.1MM. Control Impedance. Quick turn prototype, once tested, high Volume Production is accepted. It is mainly used for medical equipment. Express delivery by DHL, UPS, Fedex, TNT or any specified way of transportation, even by sea. our products are widely recognized by our customers, Please contact us if any requirements.
