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rigid printed board, Buried & Blind Via PCB, HDI. High layer PCB board. 8 layer board. Control Impedance board
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Cantidad mínima de pedido: |
pieza 1 |
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Precio: |
Based on gerber |
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Detalles del empaque: |
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Tiempo de entrega: |
8 días |
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Condiciones de pago: |
TT Transfer/paypal/Western Union/DDU |
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Capacidad de la fuente: |
10000 |
- Descripción
- Aplicaciones
- Ventaja
- Indagación
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Lugar de origen: |
China |
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Marca: |
WMDPCB |
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Número de modelo: |
8 layer blind-buried via board |
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Proceso de dar un título: |
ISO 9001 |
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Tipo: |
capa de 8 |
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Board Size: |
85 * 85MM |
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Inflamabilidad: |
V0 |
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Material de base: |
FR4 |
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Liquid Photo-Imaginable (LPI): |
verde |
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Surface treatment process: |
HASL |
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Solicitud: |
Equipo medico |
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Tipo de material: |
Rígido |
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Material: |
Fiberglass Epoxy, FR4 |
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Marca: |
wmdpcb |
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Capas: |
8Layer |
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Board Thickness: |
1.6mm |
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Finished Copper: |
1OZ all layer |
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Min.Line Width/Space: |
4 / 4mil |
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Características técnicas: |
buried via: L2-L7, blind via: L1-L2 L7-L8 |
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Minimum Hole Size: |
0.1mm |
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Comparative Tracking Index: |
CTI 175V |
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Glass Transition Temperature: |
Tg 175℃ |
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Max Operation Temperature: |
100 ℃ |
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Temperatura de descomposición |
Td 335 |
Naked Board, bare board, Use FR4 laminate material with tG > 175°C and td > 335°, Finished board thickness is to be 0.062”, Apply green liquid photo imageable solder mask to both sides of the board over bare copper, Silkscreen is white, permanent, organic, non-conductive ink. HASL--hot air solder leveled using PbSn solder, unit size：85*85MM, ship as single, The technical features is multilayer board, buried via: L2-L7 min.hole size :0.2MM, blind via: L1-L2 L7-L8 min.hole size:0.1MM. Control Impedance. Quick turn prototype, once tested, high Volume Production is accepted. It is mainly used for medical equipment. Express delivery by DHL, UPS, Fedex, TNT or any specified way of transportation, even by sea. our products are widely recognized by our customers, Please contact us if any requirements.
