printed circuit, printed wiring, printed board, printed circuit board (PCB), printed wiring board(PWB), rigid printed board, Ten layer board, rigid 10 layer printed board. Gold finger, beveling/cham
Cantidad mínima de pedido: |
pieza 1 |
Precio: |
Based on gerber |
Detalles del empaque: |
|
Tiempo de entrega: |
8 días |
Condiciones de pago: |
TT Transfer/paypal/Western Union/DDU |
Capacidad de la fuente: |
10000 |
- Descripción
- Aplicaciones
- Ventaja
- Indagación
Lugar de origen: |
China |
Marca: |
WMDPCB |
Número de modelo: |
10 layer FR4 TG170/ HIGH TEMP |
Proceso de dar un título: |
ISO 9001 |
Tipo: |
10 layer multilayer board |
Board Size: |
80 * 140MM |
Inflamabilidad: |
V0 |
Material de base: |
FR4 |
Liquid Photo-Imaginable (LPI): |
Verde |
Surface treatment process: |
ENIG 1U” |
Solicitud: |
convertidor |
Tipo de material: |
Rígido |
Material: |
Fiberglass Epoxy, FR4 |
Marca: |
wmdpcb |
Capas: |
10Layer |
Board Thickness: |
1.2mm |
Finished Copper: |
1/1/1/1/1/1/1/1/1/1OZ |
Min.Line Width/Space: |
6/6MIL |
Características técnicas: |
High layer with gold fingers |
Minimum Hole Size: |
0.2mm |
Comparative Tracking Index: |
CTI 175V |
Glass Transition Temperature: |
Tg 170℃ |
Max Operation Temperature: |
100 ℃ |
Temperatura de descomposición |
Td 320 |
Naked Board, bare board, single size 80*140MM, ship as Single, 1.2mm - 35um - 10 Layers -1mil copper inside the hole, UL MARKED and APPROVED, layer count is 8, IPC CLASS 2, All soldermask dams must be present. Gold fingers 30u” gold required on all gold fingers. 45 degrees beveling required on fingers. Make sure it has 1 mil plating inside the hole. BGA through hole plugged with soldermask. the technical features is multilayer board with 30u” gold fingers. Quick turn prototype, once tested, high Volume Production is accepted. It is mainly used for converter. express delivery by DHL, UPS, Fedex, TNT or any specified way of transportation, even by sea. our products are widely recognized by our customers, Please contact us if any requirements.