4layers Flexible-Rigid Board Immersion Silver High-precision Green Soldermask-Yellow Coverlay
Cantidad mínima de pedido: |
1 PCS |
Precio: |
Based on gerber |
Detalles del empaque: |
|
Tiempo de entrega: |
8 días |
Condiciones de pago: |
TT Transfer/paypal/Western Union/DDU |
Capacidad de la fuente: |
10000 |
- Descripción
- Aplicaciones
- Ventaja
- Indagación
Lugar de origen: |
China |
Marca: |
WMDPCB |
Número de modelo: |
4 layer Flex- rigid board |
Proceso de dar un título: |
ISO 9001 |
Tipo: |
4layer |
Board Size: |
196*135mm/1pcs |
Inflamabilidad: |
V0 |
Material de base: |
FR4, PI |
Liquid Photo-Imaginable (LPI): |
Coverlay, Green Soldermask |
Surface treatment process: |
Immersion Silver |
Solicitud: |
Electrónica de Consumo |
Tipo de material: |
Rigid+Flex |
Material: |
Fiberglass Epoxy, FR4+ PI |
Marca: |
WMDPCB |
Capas: |
4Layer |
Board Thickness: |
1.6mm |
Finished Copper: |
1OZ |
Min.Line Width/Space: |
6/6MIL |
Características técnicas: |
4Layer Flex - Rigid |
Minimum Hole Size: |
NA |
Comparative Tracking Index: |
CTI 175V |
Glass Transition Temperature: |
Tg 135℃ |
Max Operation Temperature: |
100 ℃ |
Temperatura de descomposición |
Td 335 |
4 Layers PCB, Material is FR4+PI, Thickness is 1.6mm Finished Copper is 1oz, Surface Treatment is Immersion Silver, Green soldermask and coverlay.
Rigid-flex circuits are a hybrid construction flex circuit consisting of rigid and flexible substrates which are laminated together into a single structure. Rigid-flex PCBs provide a simple means to integrate multiple PCB assemblies and other components including display, input or storage devices with thin, light composites that integrate wiring in thin, flexible ribbons between sections. One of the great advantages of Rigid Flex is the possibility of designing the circuit that will have to be adapted to the device and not the other way round, therefore the construction of a device according to the circuit, in fact they can replace wiring and complicated assembly components providing significant savings without a reduction in performance.