EN
ES
RU
PT
SV
DE
TR
FR
4layer Cu thickness 2OZ All Layers ENIG Green INK High Quanlity
|
Cantidad mínima de pedido: |
1 PCS |
|
Precio: |
Based on gerber |
|
Detalles del empaque: |
|
|
Tiempo de entrega: |
6 días |
|
Condiciones de pago: |
TT Transfer/paypal/Western Union/DDU |
|
Capacidad de la fuente: |
10000 |
- Descripción
- Aplicaciones
- Ventaja
- Indagación
|
Lugar de origen: |
China |
|
Marca: |
WMDPCB |
|
Número de modelo: |
4 layer rigid board |
|
Proceso de dar un título: |
ISO 9001 |
|
Tipo: |
capa de 4 |
|
Board Size: |
210*160MM/1UP |
|
Inflamabilidad: |
V0 |
|
Material de base: |
FR4 TG140 |
|
Liquid Photo-Imaginable (LPI): |
Verde |
|
Surface treatment process: |
ENIG |
|
Solicitud: |
Comunicación electrónica |
|
Tipo de material: |
Rígido |
|
Material: |
Fiberglass Epoxy, FR4 |
|
Marca: |
WMDPCB |
|
Capas: |
4Layer |
|
Board Thickness: |
1.6mm |
|
Finished Copper: |
2/2/2/2OZ |
|
Min.Line Width/Space: |
NA |
|
Características técnicas: |
4 Layer ENIG |
|
Minimum Hole Size: |
NA |
|
Comparative Tracking Index: |
CTI 175V |
|
Glass Transition Temperature: |
Tg 140℃ |
|
Max Operation Temperature: |
100 ℃ |
|
Temperatura de descomposición |
Td 335 |
4 Layers board. Base Material is FR4 Tg140. 1.6mm±0.1mm Board Thickness. Immersion gold, Electroless nickel and Electroless gold are deposited on features that are not covered with Solder Mask. Thickness for Nickel is between 80 to 150 micro inches and Gold thickness is 2-6 micro inches. the feature is 4 layer ENIG surface treatment with heavy copper thickness. It is mainly used in Electronic Communication. PCB Assembly Manufacturer, Online PCB Designer, Cheap Circuit Boards. We have material FR4, ROGERS, CEM-1, CEM-3, Aluminum,IMS materials, HIGH TG board, High CTI, FR4 halogen-free, Polyimide, flex board ,flex-rigid board and so on. Hope we can establish a Win-Win Business partnership with you----our valued customers.
