EN
ES
RU
PT
SV
DE
TR
FR
-
The difference between HASL and HASL lead-free
2018-08-13One of the commonly used processes for surface treatment of PCB boards is: HASL, also called "hot air leveling", which is an important process in the production of pcb circuit boards. The main soldering of pcb circuit boards is lead-free HASL. There are two types of lead-spray tin, which are also commonly used.
Read More → -
Several common surface treatment methods for pcb board prototype
2017-03-06The surface treatment methods used in pcb board proofing are different. Each surface treatment method has its own unique characteristics. Taking chemical silver as an example, its process is extremely simple.
Read More → -
What are the benefits of using "Mirror Board" on PCB printed circuit boards?
2016-12-15In the electronic assembly manufacturing industry, there are two types of Mirror Boards that we generally call. The first type(Different side mirror board) is the reverse side mirror board, and the printed circuit board is the first.
Read More → -
Talking about the source of multilayer circuit board
2015-08-05The increased concentration of integrated circuit packages leads to a high concentration of interconnects, which need the use of multilayer boards.
Read More → -
Judging the quality of the board from the color of the PCB board
2014-07-06General circuit board buyers always have doubts about the color of PCB circuit boards. They can't figure out what color line boards are good. Today, WMD circuit will explain the performance of PCB color on circuit boards. What is the impact?
Read More → -
The operation of electronic information manufacturing industry in the first half of 2018
2013-06-25In the first half of 2018, the electronic information manufacturing industry continued to maintain a steady growth trend. The growth rate of production and investment maintained a leading level in various industrial sectors.
Read More → -
International standards for pad requirements
2012-05-18The 6118 standard of the International Electrotechnical Commission IEC International Eletrotechnical Commission recognizes the need for different targets for solder fillet or pad bump conditions. This new international standard confirms two basic methods for providing information on the development of pad shapes:
Read More → -
ISO 14001: 2015 new standard officially released
2011-05-14ISO 14001, the world's first widely adopted international standard for environmental management systems, has helped more than 300,000 organizations around the world improve their environmental performance. At present, the standard has undergone the first major revision since its official release in 1996.
Read More →
