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PCB multicapa

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6 layer Blind board Immersion Gold Standard IPC2 RoHS and REACH Compliant

Cantidad mínima de pedido:

1 PCS

Precio:

Based on gerber

Detalles del empaque:

Vacuum paquete,20pnl/bag

Tiempo de entrega:

5 días

Condiciones de pago:

TT Transfer/paypal/Western Union/DDU

Capacidad de la fuente:

10000

Lugar de origen:

China

Marca:

WMDPCB

Número de modelo:

6 layer rigid board

Proceso de dar un título:

ISO 9001

Tipo:

6layer

Board Size:

184*166mm/2up

Inflamabilidad:

V0

Material de base:

FR4 TG140

Liquid Photo-Imaginable (LPI):

verde

Surface treatment process:

Immerision Gold

Solicitud:

Electrónica de Consumo

Tipo de material:

Rígido

Material:

Fiberglass Epoxy, FR4

Marca:

WMDPCB

Capas:

6Layer

Board Thickness:

1.6mm

Finished Copper:

1/1/1/1/1/1OZ

Min.Line Width/Space:

NA

Características técnicas:

6Layer Blind Vias

Minimum Hole Size:

NA

Comparative Tracking Index:

CTI 175V

Glass Transition Temperature:

Tg 140℃

Max Operation Temperature:

100 ℃

Temperatura de descomposición

Td 335

6 Layers FR4 Material Thickness is 1.6mm±0.1mm, Copper Thickness is 1OZ, Surface Treatment is immersion Gold. Blind board L1-L2, L5-L6. Blind Vias are defined as those vias that start on an outer layer but terminate on an inner layer. Blind vias help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Multilayer printed circuit boards occupy a very important part of PCB market, including the sampling and pre-series production, and WMD can realize multilayer circuits with Blind/buried vias.

Our boards can be used for communications, aerospace, security, IT, computer, medical equipment, military, power electronics and industrial control. Semiconductor.

top quality product, excellent service, competitive pricing and on time delivery.

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