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Několik běžných metod povrchové úpravy pro prototyp plošných spojů

Čas: 2017 03--06

The surface treatment methods used in pcb board proofing are different. Each surface treatment method has its own unique characteristics. Taking chemical silver as an example, its process is extremely simple. It is recommended for lead-free soldering and smt use, especially for fine The line effect is better, the most important thing is the use of chemical silver for surface treatment, which will greatly reduce the overall cost and lower cost. The following small series introduces you to several common surface treatment methods for pcb board proofing.

1. HASL hot air leveling (known as spray tin)

Spray tin is a commonly used treatment method in the early stage of pcb board proofing. Now divided into lead spray tin and lead-free spray tin. Advantages of spray tin: After the PCB is finished, the copper surface is completely wetted (completely covered with tin before soldering), suitable for lead-free soldering, low process maturity, suitable for visual inspection and electrical measurement, and also a high quality and reliable pcb board. One of the proof processing methods.

2. Chemical Nickel Gold (ENIG)

Nickel-gold is a kind of pcb plate proofing surface treatment process with large application. Remember: the nickel layer is a nickel-phosphorus alloy layer, which is divided into high-phosphorus nickel and medium-phosphorus nickel according to the phosphorus content. The application is different. Advantages of nickel-plated gold: suitable for lead-free soldering; surface is very flat, suitable for SMT, suitable for electrical testing, suitable for switch contact design, suitable for aluminum wire bonding, suitable for thick plates, strong against environmental attacks.

3. Electroplated nickel gold

Electroplated nickel gold is divided into "hard gold" and "soft gold", hard gold (such as: gold-cobalt alloy) is commonly used on gold fingers (contact connection design), soft gold is pure gold. Electroplated nickel gold is applied on IC carrier boards (such as PBGA). It is mainly suitable for gold wire and copper wire bonding. However, it is suitable for IC carrier plating. The bonded gold finger area needs extra conductive wire to be plated. Advantages of electroplating nickel-gold pcb board proofing: suitable for contact switch design and gold wire bonding; suitable for electrical testing

4. Nickel Palladium Gold (ENEPIG)

Nickel-palladium gold is now beginning to be applied in the field of pcb board proofing, and has been used in semiconductors before. Suitable for gold and aluminum wire binding. Advantages of proofing with nickel-palladium-gold pcb board: applied on IC carrier board, suitable for gold wire bonding and aluminum wire bonding. Suitable for lead-free soldering; no nickel corrosion (black plate) problem compared to ENIG; cost less than ENIG and electro-nickel gold, suitable for a variety of surface treatment processes and on board.

In addition to the above several types of pcb board proofing processing methods, it also includes chemical tin. This kind of chemical tin surface treatment is suitable for horizontal line production, and it is also used. In the fine line processing project, when you select the PCB surface proofing surface treatment method, you need to The actual situation, in connection with the characteristics of the surface treatment method, budget costs, may also choose pcb board proofing manufacturers spot wholesale products.

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